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首页 半导体制造技术txt,chm,pdf,epub,mobi下载作者:夸克 出版社: 电子工业出版社 副标题: 英文版 出版年: 2006年06月 页数: 666 页 定价: 69.0 装帧: 平装 ISBN: 9787121027109 内容简介 · · · · · ·在半导体领域,技术的变化遵循着摩尔定律的快速节奏,是以月而不是以年为单位计的。本书详细追述了半导体发展的历史并吸收了当今最新技术资料,学术界和工业界都称赞这是一本目前在市场上能得到的最全面、最先进的教材。全书共分20章,章节根据应用于半导体制造的主要技术分类来安排,内容包括：与半导体制造相关的基础技术信息；总体流程图的工艺模型概况,用流程图将硅片制造的主要领域连接起来；具体讲解每一个主要工艺；集成电路装配和封装的后部工艺概况。此外,各章为读者提供了关于质量测量和故障排除的问题,这些都是会在硅片制造中遇到的实际问题。 本书适合作为高等院校微电子技术专业的教材,也可作为从事半导体制造与研究人员的参考书及公司培训员工的标准教材。 目录 · · · · · ·Chapter 1 Introduction to the Semiconductor IndustryObjectives Introduction Development of an Industry Industry Roots The Solid State · · · · · ·() Chapter 1 Introduction to the Semiconductor Industry Objectives Introduction Development of an Industry Industry Roots The Solid State Circuit Integration Integration Eras IC Fabrication Wafer Fab Stages of IC Fabrication Semiconductor Trends Increase in Chip Performance Increase in Chip Reliability Reduction in Chip Price The Electronic Era The 1950s: Transistor Technology The 1960s: Process Technology The 1970s: Competition The 1980s: Automation The 1990s: Volume Production Careers in Semiconductor Manufacturing Technician Job Descriptions Summary Key Terms Review Questions Selected Industry Web sites REFERENCES Chapter 2 Characteristics of Semiconductor Materials Objectives Introduction Atomic Structure Electrons The Periodic Table Ionic Bonds Covalent Bonds Classifying Materials Conductors Insulators Semiconductors Silicon Pure Silicon Why Silicon* Doped Silicon pn Junctions Alternative Semiconductor Materials Gallium Arsenide (GaAs) Summary Key Terms Review Questions REFERENCES Chapter 3 Device Technologies Objectives Introduction Circuit Types Analog Circuits Digital Circuits Passive Component Structures IC Resistor Structures IC Capacitor Structures Active Component Structures The pn Junction Diod The Bipolar Junction Transistor Schottky Diode Bipolar IC Technology CMOS IC Technology 52 Enhancement and Depletion-Mode MOSFETs Latchup in CMOS Devices Integrated Circuit Products Linear IC Product Types Digital IC Product Types Summary Key Terms Review Questions IC Manufacturers’ web sites REFERENCES Chapter 4 Silicon and Wafer Preparation Objectives Introduction Semiconductor-Grade Silicon Crystal Structure Amorphous Materials Unit Cells Polycrystal and Monocrystal Structures Crystal Orientation Monocrystal Silicon Growth CZ Method Float-Zone Method Reasons for Larger Ingot Diameters Crystal Defects in Silicon Point Defects Dislocations Gross Defects Wafer Preparation Shaping Operations Wafer Slicing Wafer Lapping and Edge Contour Etching Polishing Cleaning Wafer Evaluation Packaging Quality Measures Physical Dimensions Flatness Microroughness Oxygen Content Crystal Defects Particles Bulk Resistivity Epitaxial Layer Summary Key Terms Review Questions Selected industry web sites REFEREnCES Chapter 5 Chemicals in Semiconductor Fabrication Objectives Introduction States of Matter Properties of Materials Chemical Properties for Semiconductor Manufacturing Process Chemicals Liquids Gases Summary Key Terms Review Questions Chemical Suppliers’ Web Sites REFERENCES Chapter 6 Contamination Control in Wafer Fabs Objectives Introduction Clean Background Types of Contamination Particles Metallic Impurities Organic Contamination Native Oxides Electrostatic Discharge Sources and Control of Contamination Air Humans Facility Water Process Chemicals Production Equipment Workstation Design Wafer Wet Cleaning Wet-Cleaning Overview Wet-Clean Equipment Alternatives to RCA Clean Summary Key Terms Review Questions CHEMICAL AND EQUIPMENT SUPPLIERS’ WEB Sites REFERENCES Chapter 7 Metrology and Defect Inspection Objectives Introduction IC Metrology Measurement Equipment Yield Data Management Quality Measures Film Thickness Film Stress Refractive Index Dopant Concentration Unpatterned Surface Defects Patterned Surface Defects Critical Dimension (CD) Step Coverage Overlay Registration Capacitance-Voltage (C-V) Test Contact Angle Analytical Equipment Secondary-Ion Mass Spectrometry (SIMS) Atomic Force Microscope (AFM) Auger Electron Spectroscopy (AES) X-Ray Photoelectron Spectroscopy (XPS) Transmission Electron Microscope (TEM) Energy- and Wavelength-Dispersive Spectrometer (EDX and WDX) Focused Ion Beam (FIB) Summary Key Terms Review Questions Metrology Equipment Suppliers* Web Sites REFERENCES Chapter 8 Gas Control in Process Chambers Objectives Introduction Vacuum Vacuum Ranges Mean Free Path Vacuum Pumps Roughing Pump High Vacuum Pump Vacuum in Integrated Tools Process Chamber Gas Flow Mass Flow Controllers Residual Gas Analyzer (RGA) RGA Basics RGA as Real-Time Monitor Plasma Glow Discharge Process Chamber Contamination Summary Key Terms Review Questions Vacuum Equipment Suppliers’ Web Sites References Chapter 9 IC Fabrication Process Overview Objectives Introduction CMOS Process Flow Overview of Areas in a Wafer Fab CMOS Manufacturing Steps 1. Twin Well Process 2. Shallow Trench Isolation Process 3. Poly Gate Structural Process 4. Lightly Doped Drain (LDD) Implant Process 5. Sidewall Spacer Formation 6. Source/Drain (S/D) Implant Processes 7. Contact Formation 8. Local Interconnect (LI) Process 9. Via-1 and Plug-1 Formation 10. Metal-1 Interconnect Formation 11. Via-2 and Plug-1 Formation 12. Metal-2 Interconnect Formation 13. Metal-3 to Pad Etch and Alloy 14. Parametric Testing Summary Key Terms Review Questions References Chapter 10 Oxidation Objectives Introduction Oxide Film Nature of Oxide Film Uses of Oxide Film Thermal Oxidation growth Chemical Reaction for Oxidation Oxidation Growth Model Furnace Equipment Horizontal Versus Vertical Furnaces Vertical Furnace Fast Ramp Vertical Furnace Rapid Thermal Processor Oxidation Process Pre Oxidation Cleaning Oxidation Process Recipe Quality Measurements Oxidation Troubleshooting Summary Key Terms Review Questions FURNACE AND RTP EQUIPMENT Suppliers’ Web Sites References Chapter 11 Deposition Objectives Introduction Film Layering Terminology Film Deposition Thin-Film Characteristics Film Growth Film Deposition Techniques Chemical Vapor Deposition CVD Chemical Processes CVD Reaction CVD Deposition Systems CVD Equipment Design APCVD (Atmospheric Pressure CVD) LPCVD (Low Pressure CVD) Plasma-Assisted CVD Dielectrics and Performance Dielectric Constant Device Isolation Spin-On-Dielectrics Spin-On-Glass (SOG) Spin-On-Dielectric (SOD) Epitaxy Epitaxy Growth Methods CVD Quality Measures CVD Troubleshooting Summary Key Terms Review Questions Deposition Equipment Suppliers’ Web Sites REFERENCES Chapter 12 Metallization Objectives Introduction Types of Metals Aluminum Aluminum-Copper Alloys Copper Barrier Metals Silicides Metal Plugs Metal Deposition Systems Evaporation Sputtering Metal CVD Copper Electroplate Metallization Schemes Traditional Aluminum Structure Copper Damascene Structure Metallization Quality Measures Metallization Troubleshooting Summary Key Terms Review Questions Metallization Equipment and Materials Suppliers’ Web Sites REFERENCES Chapter 13 Photolithography: Vapor Prime to Soft Bake Objectives Introduction Photolithography Concepts Photolithography Processes Negative Lithography Positive Lithography Eight Basic Steps of Photolithography Step 1: Vapor Prime Step 2: Spin Coat Step 3: Soft Bake Step 4: Alignment and Exposure Step 5: Post-Exposure Bake (PEB) Step 6: Develop Step 7: Hard Bake Step 8: Develop Inspect Vapor Prime Wafer Cleaning Dehydration Bake Wafer Priming Spin Coat Photoresist Photoresist Physical Properties Conventional I-Line Photoresists Deep UV (DUV) Photoresists Photoresist Dispensing Methods Soft Bake Soft Bake Equipment Process Characterization Photoresist Quality Measures Photoresist Troubleshooting Summary Key Terms Review Questions PHOTORESIST MATERIALS AND EQUIPMENT Suppliers’ Web Sites References Chapter 14 Photolithography: Alignment and Exposure Objectives Introduction Importance of Alignment and Exposure Optical Lithography Light Exposure Sources Optics Resolution Photolithography Equipment Contact Aligner Proximity Aligner Scanning Projection Aligner Step-and-Repeat Aligner (Stepper) Step-and-Scan System Reticles Optical Enhancement Techniques Alignment Environmental Conditions Comparison of Photo Tools Mix and Match AlignMENT and ExpoSURE Quality Measures AlignMENT and ExposURe Troubleshooting Summary Key Terms Review Questions PhotoRESIST materials AND Equipment Suppliers’ Web Sites REFERENCES Chapter 15 Photolithography: PHOTOResist Development and Advanced Lithography Objectives Introduction Advanced Lithography Post-Exposure Bake DUV Post-Exposure Bake (PEB) Conventional I-Line PEB Develop Negative Resist Positive Resist Development Methods Resist Development Parameters Hard Bake Develop Inspect Advanced Lithography Next-Generation Lithography Advanced Resist Processing Develop Quality Measures Develop Troubleshooting Summary Key Terms Review questions Photolithography Materials AND EQUIPMENT Suppliers’ Web Sites REFERENCES Chapter 16 Etch Objectives Introduction Etch Processes Etch Parameters Etch Rate Etch Profile Etch Bias Selectivity Uniformity Residues Polymer Formation Plasma-Induced Damage Particle Contamination Dry Etch Etching Action Potential Distribution Plasma Etch Reactors Barrel Plasma Etcher Parallel Plate (Planar) Reactor Downstream Etch Systems Triode Planar Reactor Ion Beam Milling Reactive Ion Etch (RIE) High-Density Plasma Etchers Etch System Review Endpoint Detection Vacuum for Etch Chambers Dry Etch Applications Dielectric Dry Etch Silicon Dry Etch Metal Dry Etch Wet Etch Types of Wet Etch Historical Perspective Photoresist Removal Plasma Ashing ETCH Inspection ETCH Inspection Quality Measures Dry Etch Troubleshooting Summary Key Terms Review Questions Etch Equipment Suppliers’ Web Sites REFERENCES Chapter 17 Ion Implant Objectives Introduction Doped Regions Diffusion Diffusion Principles Diffusion Process Ion Implantation Overview Ion Implant Parameters Ion Implanters Ion Source Extraction and Ion Analyzer Acceleration Column Scanning System Process Chamber Annealing Channeling Particles Ion Implant Trends IN PROCESS INTEGRATION Deep Buried Layers Retrograde Wells Punchthrough Stoppers Threshold Voltage Adjustment Lightly Doped Drain Source/Drain Implants Polysilicon Gate Trench Capacitor Ultrashallow Junctions Silicon-On-Insulator (SOI) Ion Implant Quality Measures Ion Implant Troubleshooting Summary Key Terms Review Questions Ion Implanter Equipment Suppliers’ Web Sites REFERENCES Chapter 18 Chemical Mechanical Planarization Objectives Introduction Traditional Planarization Etchback Glass Reflow Spin-On Films Chemical Mechanical Planarization CMP Planarity Advantages of CMP CMP Mechanisms CMP Slurry and Pad CMP Equipment CMP Clean CMP Equipment Manufacturers CMP Applications STI Oxide Polish LI Oxide Polish LI Tungsten Polish ILD Oxide Polish Tungsten Plug Polish Dual-Damascene Copper Polish CMP Quality Measures CMP Troubleshooting Summary Key Terms Review Questions CMP Equipment Suppliers’ Web Sites REFERENCES Chapter 19 Wafer Test Objectives Introduction IC Electrical Tests Wafer Test In-Line Parametric Test Wafer Sort Yield Wafer Sort Yield Models Test Quality Measures Test Troubleshooting Summary Key Terms Review questions Test and prober equipment suppliers’ Web sites REFERENCES Chapter 20 Assembly and Packaging Objectives Introduction Packaging Levels Traditional Assembly Backgrind Die Separation Die Attach Wirebonding Traditional Packaging Plastic Packaging Ceramic Packaging Final Test Advanced Assembly and Packaging Flip Chip Ball Grid Array (BGA) Chip on Board (COB) Tape Automated Bonding (TAB) Multichip Module (MCM) Chip Scale Packaging (CSP) Wafer-Level Packaging Assembly and Packaging Quality Measures IC Packaging Troubleshooting Summary Key Terms Review questions Assembly and Packaging Suppliers’ Web Sites References Appendices Appendix A Chemicals and Safety Appendix B Contamination Controls in Cleanrooms Appendix C Units Appendix D Color as a Function of Oxide Thickness Appendix E Overview of PHOTOResist Chemistry Appendix F Etch Chemistry Glossary INDEX · · · · · · () |
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作者： 见己
追了很久,新书当然要力挺。
思想很新颖
最新力作,好看
还没有看,不错